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Product Details:
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Si3N4 ceramic substrate has been widely used in electronic packaging field. Due to its excellent thermal conductivity, insulation and mechanical strength, Si3N4 ceramic substrates are often used as the base material for manufacturing large-scale integrated circuits and sealing. In addition, it is suitable for the packaging of high-performance modules, especially in applications requiring high power density, high chip temperature and high reliability. The long service life and high reliability of the Si3N4 substrate can meet the high requirements of modern electronic equipment
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