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Si3n4 Ceramic Substrate , Silicon Nitride (si3n4) Electronic Ceramic Substrate, Silicon Nitride Ceramic Substrate For El

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Si3n4 Ceramic Substrate , Silicon Nitride (si3n4) Electronic Ceramic Substrate, Silicon Nitride Ceramic Substrate For El

Si3n4 Ceramic Substrate , Silicon Nitride (si3n4) Electronic Ceramic Substrate, Silicon Nitride Ceramic Substrate For El
Si3n4 Ceramic Substrate , Silicon Nitride (si3n4) Electronic Ceramic Substrate, Silicon Nitride Ceramic Substrate For El Si3n4 Ceramic Substrate , Silicon Nitride (si3n4) Electronic Ceramic Substrate, Silicon Nitride Ceramic Substrate For El

Large Image :  Si3n4 Ceramic Substrate , Silicon Nitride (si3n4) Electronic Ceramic Substrate, Silicon Nitride Ceramic Substrate For El

Product Details:
Place of Origin: Henan
Brand Name: Jingnawei
Model Number: as you need
Payment & Shipping Terms:
Minimum Order Quantity: 1 peice
Price: negotiable
Packaging Details: box
Delivery Time: 5-8 days
Payment Terms: L/C,T/T,Western Union
Supply Ability: 500,000 tablets per month

Si3n4 Ceramic Substrate , Silicon Nitride (si3n4) Electronic Ceramic Substrate, Silicon Nitride Ceramic Substrate For El

Description

1. High thermal conductivity, meeting the heat dissipation requirements of devices;

2. Good heat resistance, meeting the high-temperature (more than 200℃) application requirements of power devices;

3. Thermal expansion coefficient matching, matching with the thermal expansion coefficient of chip material, reducing packaging thermal stress;

4. Low dielectric constant, good high frequency characteristics, reducing the signal transmission time of the device and improving the signal transmission rate;

5. High mechanical strength, meeting the requirements of mechanical properties in the process of device packaging and application;

6. Good corrosion resistance, able to withstand strong acid, strong alkali, boiling water, organic solution and other corrosion;

7. Compact structure, meeting the requirements of airtight packaging of electronic devices;


Silicon Nitride Ceramic Substrate


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   Substrate material     Si3N4      AIN     Al2O3
  Strength /(MPa)600~700350400
Fracture toughness/(MPa·m½)6.0-7.02.73
Thermal conductivity/[W/(m·K)]≥90≥150≥25
Current carrying capacity /A≥300100~300≤ 100
Thermal resistance /(℃ /W)≤0.5≤0.5≥0.1
Reliability/time≥5000200300
Use-costhigherhigherlow


Note : As customers demands

Si3n4 Ceramic Substrate , Silicon Nitride (si3n4) Electronic Ceramic Substrate, Silicon Nitride Ceramic Substrate For El 1




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Application:


high-power power semiconductor module; Semiconductor refrigerator, electronic heater; Power control circuit, power hybrid circuit. Intelligent power components; High frequency switching power supply, solid state relay. Automotive electronics, aerospace and military electronic components. Solar panel assembly; Telecommunications private exchange, receiving system; Laser and other industrial electronics.



Company Information


Si3N4-heater


Jinchuan-2Jinchuan





Packaging & Shipping


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FAQ


1. Q : Are you manufacturer ?
    A : Yes , we are manufacturer and product more than 10 years .


 2.Q : Can you provide free samples ?
    A : Yes , The sample is free  .


 3.Q: What is your MOQ ?
    A : 1 pcs , We accept smaller quantity but price is higher .


 4.Q : What is your production time for bulk order ?
    A :   7-10 days ,  According to order quantity .


Contact Details
Jiaozuo Jinchuan electronic Technology Co., LTD
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